ClassOne Technology
At ClassOne, our mission is to deliver the world’s highest performing and most elegantly designed electroplating and wet processing systems for the manufacture of advanced microelectronics.
Manual and Automated Electroplating Tools with Application Lab for Process Support
New & Refurbished Spray Solvent Tools (SST’s) for Photoresist Strip or Metal Lift-Off Applications
New Manufactured Single or Double Stack Spin Rinse Dryers for 50 - 300 mm Capability
Electroplating and Surface Preparation Tools | Spray Solvent Tools | Spin Rinse Dryers
Solstice S8 Electroplating and Surface Preparation Tools for Volume Production
Solstice S4 Electroplating and Surface Preparation Tools for Light Production
Solstice LT Electroplating and Surface Preparation Tools for R&D
Trident SST Spray Solvent Tools
Trident SRD Spin Rinse Dryer Tools
Solstice S8
Solstice S4
Solstice LT
Trident™ SST
Trident™ SRD
Application Datasheets
Brochures & Product Datasheets
Articles & Ads
Videos
Technology Papers
Advanced Semiconductor Plating –
Key Fundamentals
Process Application Note #100 – This paper provides background fundamentals of electrochemical deposition (ECD) in the semiconductor industry for engineers, technicians, and other personnel involved in plating processes. See Summary Overview
Electroplating Fundamentals – Optimizing Cross-wafer
Process Application Note #101 – This paper presents the basic principles and methodologies for helping process engineers to achieve optimized cross-wafer uniformity in semiconductor electroplating. It provides guidance for users of different plating systems. See Summary Overview